ShanghaiTech IC Initiative Global Faculty Recruitment

Jointly founded by Shanghai Municipal People’s Government and the Chinese Academy of Sciences (CAS) in 2013, ShanghaiTech University aspires to be a small-scale, high-standard, international university oriented towards research and innovation, for nurturing the next generation of innovative scientists, inventors, and entrepreneurs. On February 14, 2022, ShanghaiTech joined the list of China’s World-Class Universities Project as the youngest university in that list.

The School of Information Science and Technology (SIST) at ShanghaiTech University aims to lead the change in China's higher education reform by becoming a top academic research institution that is home to world-class research laboratories and faculty members. In 2026, SIST is launching a Global Faculty Recruitment Initiative in Integrated Circuits(IC) to attract world-class scholars and researchers. We invite outstanding individuals to join us in building an internationally renowned hub of excellence in IC education, research, and innovation.

Contact

School of Information Science and Technology (SIST) Website: https://sist.shanghaitech.edu.cn/

Contact Person: Ms. Xu

Email: sist@shanghaitech.edu.cn

Key Research Areas (including but not limited to):

1. Computing Chips & Optoelectronic AI Architectures

-AI accelerator chips for large models, in-memory computing, and neuromorphic architectures

-RISC-V-based agile chip design and hardware security

-Photonic neural network chips for AI optical computing and edge applications

2. Analog, RF, and Communication/Interconnect ICs

-RF/mmWave/THz communication chips for 6G and satellite networks

-Ultra-high-speed data converters and silicon photonics/CPO interfaces

-Ultra-low-power analog front-ends and implantable biomedical microelectronics

-Cryogenic control/readout ICs for large-scale quantum computing

3. AI-Driven EDA & Advanced Packaging

-AI-enhanced EDA algorithms and design automation platforms

-Multi-physics co-simulation tools for advanced nodes

-Chiplet integration and 2.5D/3D advanced packaging

4. Emerging Devices & Heterogeneous Integration

-Engineering validation of spintronic devices, MRAM, and cryo-CMOS

-Core physical devices for quantum computing interfaces

-Silicon Photonics/MEMS and CMOS Heterogeneous IC

5. Power Management IC & Power Electronics Devices

-High-performance PMICs and chiplets for AI computing clusters

-Wide/ultra-wide bandgap power device design and integration

-Automotive-grade power devices and PMICs

Open Position

Tenure-Track / Tenured Faculty ---

Qualifications

1. Earned or about to receive a doctoral degree, with outstanding academic experience at world-class

institutions

2. Demonstrated record of outstanding research achievements or significant tape-out experience in IC design

3. Proven ability to lead an independent research group; industrial R&D experience is a plus

4. Commitment to teaching undergraduate and graduate courses and contributing to interdisciplinary IC+ talent development

5. Strong collaborative spirit and capacity to drive interdisciplinary innovation at the intersection of ICs and emerging technologies

Benefits & Support

- Competitive Compensation

Highly competitive salary

- Start-up and Computing Resources

Substantial start-up funding, dedicated laboratory space, priority access to EDA licenses, advanced test equipment, and IC tape-out budgets

- Research Team Development

Autonomy in team building, with priority allocation of PhD student quotas and institutional support for hiring postdocs and engineers

- Talent Benefits

Shanghai household registration support; Comprehensive social insurance, supplementary medical insurance, Housing Provident Fund and Supplementary Housing Provident Fund; One-time

relocation allowance

- Housing Support

Access to university-provided faculty housing and/or competitive housing subsidies.

- Education for Children

Eligibility for enrollment in high-quality affiliated kindergarten, primary, and secondary schools.

- Healthcare Benefits

Comprehensive commercial medical insurance and annual health examination programs.

- Relocation and Talent Programs

Comprehensive relocation assistance, including support for national and Shanghai talent programs, housing allowances, and related benefits.

- Career Development and Funding Opportunities

Full support for tenure-track progression, major national/provincial grant applications, and elite talent programs

Required Materials

▪ A cover letter detailing your major research accomplishments

▪ Detailed English CV (including education, professional experience, publications, research projects, and honors) ▪ 3 representative research papers

▪ 2-page research statement (research interests and future plan)

▪ 3 professional references

How to Apply

Interested candidates should submit the following materials via the official application portal: https://wenjuan.shanghaitech.edu.cn/vm/rpgPrs5.aspx